5G移(Yi)动(Dong)设(She)备(Bei)热(Re)管(Guan)散(San)热(Re)-两(Liang)层(Ceng)薄(Bao)铜(Tong)板(Ban)构(Gou)建(Jian)的(De)亚(Ya)毫(Hao)米(Mi)薄(Bao)型(Xing)环(Huan)路(Lu)热(Re)管(Guan)
发(Fa)布(Bu)者(Zhe):(?)Tycooler浏(Liu)览(Lan)量(Liang):(?)1066
近(Jin)期(Qi),(?)富(Fu)士(Shi)通(Tong)实(Shi)验(Yan)室(Shi)有(You)限(Xian)公(Gong)司(Si)((?)Fujitsu Laboratories Ltd)(?)与(Yu)名(Ming)古(Gu)屋(Wu)大(Da)学(Xue)机(Ji)械(Xie)系(Xi)统(Tong)工(Gong)程(Cheng)系(Xi)((?)Department of Mechanical System Engineering, Nagoya University)(?)的(De)研(Yan)究(Jiu)人(Ren)员(Yuan)在(Zai)《(?)Applied Thermal Engineering》(?)期(Qi)刊(Kan)发(Fa)表(Biao)了(Liao)将(Jiang)两(Liang)层(Ceng)铜(Tong)板(Ban)制(Zhi)造(Zao)的(De)亚(Ya)毫(Hao)米(Mi)厚(Hou)薄(Bao)型(Xing)环(Huan)路(Lu)热(Re)管(Guan)应(Ying)用(Yong)于(Yu)5G智(Zhi)能(Neng)电(Dian)子(Zi)设(She)备(Bei)散(San)热(Re)的(De)研(Yan)发(Fa)成(Cheng)果(Guo)。(?)Submillimeter-thick loop heat
了(Liao)解(Jie)详(Xiang)细(Xi) >